ICL Experimenter Test Chip Taped Out
ICL Experimenter Test Chip Taped Out
The ICL experimenter test chip has been taped-out. It will be fabricated in the AMS 0.35um process and dies are expected back for testing by September 2018. The chip is the first Arm-ECS test-chip designed to test our contactless 3D integration technology, where data is communicated wirelessly between stacked tiers using inductive coupling.
Section of the ICL Experimenter Test Chip
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ICLexperimenter-2018
Taped-out in May 2018, ICL-Experimenter is the first in a series of Arm-ECS research centre test-chips designed to explore wireless 3D integration using inductive coupling links. The chip was fabricated in AMS 0.35um technology with two vertically stacked dies within each IC. This initial prototype contains eight wireless channels, each of which communicates over a distance of 120um (through 100um of silicon substrate + 20um of epoxy adhesive) and focusses on exploring different transceiver designs and inductor layouts. Wireless 3D integration is a novel approach to 3D die stacking which avoids the inflated design, fabrication and manufacturing costs associated with…